HDI 1OZ ENIG2U'' 0.1mm Dril Holes 6Layer ROHS Printed Circuit Boards HDI Printed Circuit Boards
Detailed Specifications
| Material | FR4 |
| Finish Board Thickness | 1.6MM |
| Finsh Copper Thickness | 1OZ |
| Layer | 6 |
| Soldermask Color | GREEN |
| Silkscreen | WHITE |
| Surface Treatment | ENIG2U'' |
| Finished Size | CUSTOMIZED |
Features of HDI PCB
- One Stop OEM Service: Made in Shenzhen of China
- Manufactured by Gerber File and Bom LIst Offered by Customers
- SMT, DIP Technology Support
- FR4 Material Meet 94v0 Standard
- UL,CE,ROHS Compliant
- Standard Lead Time: 4-5days for 2L;5-7 for 4L. Expedited Service is available
What KAZ Circuit can do for you:
- PCB manufacturing (prototype, small to medium, mass production)
- Components Sourcing
- PCB Assembly/SMT/DIP
To get a full quotation of the PCB/PCBA, pls provide the information as below:
- Gerber File, with detail specification of the PCB
- BOM List (Better with excel fomart)
- Photoes of the PCBA (If you have done this PCBA before)
Company Informaiton:
KAZ Circuit is a professional PCB manufacturer from China since 2007, also provide PCB Assembly service for our customers. Now with about 300 employees. Certified with ISO9001,TS16949, UL, RoHS. We are confident to provide you quality products with factory-directed price within the fastest delivery time!
Manufacturer Capacity:
| Capacity | Double Sided: 12000 sq.m / month
Multilayers: 8000sq.m / month |
| Min Line Width/Gap | 4/4 mil (1mil=0.0254mm) |
| Board Thickness | 0.3~4.0mm |
| Layers | 1~20 layers |
| Material | FR-4, Aluminum, PI |
| Copper Thickness | 0.5~4oz |
| Material Tg | Tg140~Tg170 |
| Max PCB Size | 600*1200mm |
| Min Hole Size | 0.2mm (+/- 0.025) |
| Surface Treatment | HASL, ENIG, OSP |
HDI printed circuit boards, also known as microvia or μvia PCBs, are an advanced PCB technology that enable high-density interconnections and miniaturized electronic components.
Key features and functions of HDI printed circuit boards include:
Miniaturization and increased density:
HDI PCBs feature smaller, more closely spaced vias and vias, allowing for higher interconnect density.
This makes it possible to design more compact, space-saving electronic devices and components.
Microvias and Stacked Vias:
HDI PCBs use microvias, which are smaller, laser-drilled holes that are used to connect different layers of the PCB.
Stacked vias, where multiple vias are stacked vertically, can further increase interconnect density.
Multi-layer structure:
HDI PCBs can have a higher layer count than traditional PCBs, typically 4 to 10 or more.
The increased number of layers allows for more complex routing and more connections between components.
Advanced materials and processes:
HDI PCBs often use specialized materials such as thin copper foil, high-performance laminates, and advanced plating techniques.
These materials and processes enable the creation of smaller, more reliable, higher-performance interconnects.
Improved electrical properties:
The reduced trace widths, shorter signal paths, and tighter tolerances of HDI PCBs help improve electrical performance, including improved signal integrity, reduced crosstalk, and faster data transmission.
Reliability & Manufacturability:
HDI PCBs are designed for high reliability, with features like improved thermal management and enhanced mechanical stability.
Manufacturing processes for HDI PCBs, such as laser drilling and advanced plating techniques, require specialized equipment and expertise.
HDI printed circuit board applications include:
Smartphones, Tablets, and Other Mobile Devices
Wearable Electronics and IoT (Internet of Things) Devices
Automotive electronics and advanced driver assistance systems (ADAS)
High speed computing and telecommunications equipment
Military and aerospace electronic equipment
Medical devices and instruments
The continued demand for miniaturization, enhanced functionality, and higher performance in a variety of electronic products and systems has driven the adoption of HDI PCB technology.
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