4 Layers Black Soldmask White Silkscreen Prototype PCB Assembly manufacturer
1. Features of acquisition module circuit board
1. One Stop OEM Service, Made in Shenzhen of China
2. Manufactured by Gerber File and BOM List from Customer
3. FR4 Material, Meet 94V0 standard
4. SMT, DIP technology suport
5. Lead Free HASL, Environmental Protection
6. UL, CE, ROHS Compliant
7. Shipping By DHL,UPS, TNT, EMS or Customer requirement
2. module circuit board Technical capability
| SMT | Position accuracy:20 um |
| Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP |
| Max. component height::25mm |
| Max. PCB size:680×500mm |
| Min. PCB size:no limited |
| PCB thickness:0.3 to 6mm |
| PCB weight:3KG |
| Wave-Solder | Max. PCB width:450mm |
| Min. PCB width: no limited |
| Component height:Top 120mm/Bot 15mm |
| Sweat-Solder | Metal type :part, whole, inlay, sidestep |
| Metal material:Copper , Aluminum |
| Surface Finish:plating Au, plating sliver , plating Sn |
| Air bladder rate:less than20% |
| Press-fit | Press range:0-50KN |
| Max. PCB size:800X600mm |
| Testing | ICT,Probe flying,burn-in,function test,temperature cycling |
PCB Assembly(SMT) Product Capacity
| SMT Capacity |
| SMT Item | Capacity |
| PCB Max. size | 510mm*1200mm(SMT) |
| Chip component | 0201, 0402, 0603, 0805, 1206 package |
| Min.pin space of IC | 0.1mm |
| Min. space of BGA | 0.1mm |
| Max.precision of IC assembly | ±0.01mm |
| Assembly capacity | ≥8 million piots/day |
| DIP capacity | 6 DIP production lines |
| Assembly testing | Bridge test,AOI test, X-Ray test, ICT(In Circuit Test),FCT(Functional Circuit Test) |
FCT(Functional Circuit Test) | Current test, voltage test, high temperature and low temperature test,Drop Impact Test,aging test,water proof test,leakage-proof test and etc.Different test can be done according to your requirement. |
2. PCBA Pictures
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4 Layers Black Soldmask White Silkscreen Prototype PCB Assembly Images
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